Invention Grant
- Patent Title: Wafer level camera module and method of manufacture
- Patent Title (中): 晶圆级相机模块及制造方法
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Application No.: US11698776Application Date: 2007-01-26
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Publication No.: US08456560B2Publication Date: 2013-06-04
- Inventor: Harpuneet Singh
- Applicant: Harpuneet Singh
- Applicant Address: US CA San Jose
- Assignee: DigitalOptics Corporation
- Current Assignee: DigitalOptics Corporation
- Current Assignee Address: US CA San Jose
- Agency: Henneman & Associates, PLC
- Agent Larry E. Henneman, Jr.; Gregory P. Gibson
- Main IPC: G02B13/16
- IPC: G02B13/16 ; H04N5/225 ; H01L31/0203

Abstract:
A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps.
Public/Granted literature
- US20080180566A1 Wafer level camera module and method of manufacture Public/Granted day:2008-07-31
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