Invention Grant
- Patent Title: Measurement system and measurement processing method
- Patent Title (中): 测量系统和测量处理方法
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Application No.: US13595013Application Date: 2012-08-27
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Publication No.: US08456621B2Publication Date: 2013-06-04
- Inventor: Kazuyuki Ota , Masakazu Matsugu , Kenji Saitoh
- Applicant: Kazuyuki Ota , Masakazu Matsugu , Kenji Saitoh
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Cowan, Liebowitz & Latman, P.C.
- Priority: JP2009-150322 20090624
- Main IPC: G01N21/00
- IPC: G01N21/00

Abstract:
This invention is directed to extract the scattering characteristic of a measurement target together when measuring the surface shape in a measurement system, which measures the surface shape of a measurement target, by the pattern projection method. To accomplish this, the measurement system includes an illumination unit which irradiates a measurement target with dot pattern light, a reflected light measurement unit which receives the reflected light at a reflection angle almost equal to a incident angle, and a reflected light extraction unit which extracts the inclination of the surface of the measurement target, based on the shift amount between the light receiving position of the received reflected light and a predetermined reference position, and extracts the luminance value of the reflected light and the dot diameter of the dot pattern light as information about the scattering characteristic.
Public/Granted literature
- US20120327400A1 MEASUREMENT SYSTEM AND MEASUREMENT PROCESSING METHOD Public/Granted day:2012-12-27
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