Invention Grant
- Patent Title: Power supply assembly
- Patent Title (中): 电源总成
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Application No.: US12887227Application Date: 2010-09-21
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Publication No.: US08456810B2Publication Date: 2013-06-04
- Inventor: Yun-Lung Chen , Can-Ming Liang , Gang Su , Nian-Yuan Yang
- Applicant: Yun-Lung Chen , Can-Ming Liang , Gang Su , Nian-Yuan Yang
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010162017 20100504
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
A power supply assembly includes an enclosure body, a cover panel mounted to the enclosure body, a power supply, and a positioning element mounted to the cover panel. The enclosure body includes a bottom panel, a rear panel substantially perpendicular to the bottom panel, and a side panel substantially perpendicular to the bottom panel and the rear panel. The power supply assembly is mounted in the enclosure body and is prevented from moving in a first direction, that is substantially perpendicular to the rear panel, and a second direction, that is substantially perpendicular to the side panel, and disposed between the bottom panel and the cover panel. The positioning element includes a first ladder-shaped positioning tab abutting two adjacent surfaces of the power supply and preventing the power supply assembly from moving in a third direction, that is substantially perpendicular to the cover panel and the second direction.
Public/Granted literature
- US20110273843A1 POWER SUPPLY ASSEMBLY Public/Granted day:2011-11-10
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