Invention Grant
- Patent Title: Electronic device housing and manufacturing method thereof
- Patent Title (中): 电子设备外壳及其制造方法
-
Application No.: US12979473Application Date: 2010-12-28
-
Publication No.: US08456812B2Publication Date: 2013-06-04
- Inventor: Jing-Hua Yuan , Zi-Ming Tang , Fa-Guang Shi , Cong-Cong Wang
- Applicant: Jing-Hua Yuan , Zi-Ming Tang , Fa-Guang Shi , Cong-Cong Wang
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010587317 20101214
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00 ; H04M1/00

Abstract:
An electronic device housing includes a bottom housing, a support frame, a display panel, and a side frame. The bottom housing includes a base plate and four sidewalls extending from a periphery of the base plate. The support frame is welded to the sidewalls of the bottom housing. The support frame is received in the bottom housing and made up of at least two support plates, two ends of each are welded to ends of the adjacent support plates. The support frame forms at least two welding lines at joints of the at least two support plates, and each welding line corresponds to a middle portion of one sidewall. The display panel is positioned on the support frame sandwiched between the support frame and the side frame. The side frame is connected to a top edge of the bottom housing.
Public/Granted literature
- US20120147532A1 ELECTRONIC DEVICE HOUSING AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-06-14
Information query