Invention Grant
- Patent Title: Structure assembled to panel
- Patent Title (中): 结构组装到面板
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Application No.: US13143105Application Date: 2009-12-15
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Publication No.: US08456816B2Publication Date: 2013-06-04
- Inventor: Hideyuki Hirota
- Applicant: Hideyuki Hirota
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2009-068266 20090319
- International Application: PCT/JP2009/006879 WO 20091215
- International Announcement: WO2010/106602 WO 20100923
- Main IPC: G06F1/16
- IPC: G06F1/16
Abstract:
A structure assembled to a panel includes a panel 7, a hood 6, and a filter 5, and is arranged such that the hood 6 and the filter 5 are assembled to the panel 7 independently from each other by the engagement between resiliently engaging claws and engaging concavities.
Public/Granted literature
- US20110267750A1 STRUCTURE ASSEMBLED TO PANEL Public/Granted day:2011-11-03
Information query
