Invention Grant
- Patent Title: Cooling structure for housing device
- Patent Title (中): 住房装置的冷却结构
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Application No.: US13064551Application Date: 2011-03-30
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Publication No.: US08456839B2Publication Date: 2013-06-04
- Inventor: Takashi Shirakami , Tetsuya Murayama , Kazuhiro Iino , Yoshiaki Tada , Yusuke Kira
- Applicant: Takashi Shirakami , Tetsuya Murayama , Kazuhiro Iino , Yoshiaki Tada , Yusuke Kira
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2010-143622 20100624
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
With respect to a housing device having a plurality of slots in which plug-in units are mountable, division plates corresponding to the positions of the openings of the slots are put in the inside of a baffle section for changing the direction of the flow of cooling air released from the slots, and the division plates are used to divide the inside space of the baffle section into a plurality of regions corresponding to the slots, thereby reducing mutual interference of the cooling air from the slots in the baffle section and preventing a further increase in differences in the amount of passing air among the slots. Thereby, even if any difference occurs in the amount of passing air among the slots due to a structural factor, it is possible to reduce the deterioration of the cooling capacity of a slot through which relatively less amount of air passes.
Public/Granted literature
- US20110317360A1 Cooling structure for housing device Public/Granted day:2011-12-29
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