Invention Grant
- Patent Title: Modular data center cooling
- Patent Title (中): 模块化数据中心冷却
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Application No.: US13093098Application Date: 2011-04-25
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Publication No.: US08456840B1Publication Date: 2013-06-04
- Inventor: Jimmy Clidaras , William Hamburgen , Winnie Leung , David W. Stiver , Andrew B. Carlson , Steven T. Y. Chow , Jonathan D. Beck
- Applicant: Jimmy Clidaras , William Hamburgen , Winnie Leung , David W. Stiver , Andrew B. Carlson , Steven T. Y. Chow , Jonathan D. Beck
- Applicant Address: US CA Mountain View
- Assignee: Exaflop LLC
- Current Assignee: Exaflop LLC
- Current Assignee Address: US CA Mountain View
- Agency: Fish & Richardson P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A rack-mount computer system includes one or more rows of computer racks, wherein each row of computer racks includes a pair of rows of computer racks positioned back-to-back relative to each other, a plurality of computer motherboards mounted in each of the racks in each row of computer racks and having front edges open to a workspace for receiving circulating air over the motherboards, the motherboards positioned to create a warm air plenum near a back edge of each motherboard, and a fan positioned adjacent each of the plurality of computer motherboards to circulate air across the computer motherboards and into the warm air plenum.
Information query