Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US13212179Application Date: 2011-08-18
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Publication No.: US08456855B2Publication Date: 2013-06-04
- Inventor: Yung-Chieh Chen , Duen-Yi Ho , Shou-Kuo Hsu
- Applicant: Yung-Chieh Chen , Duen-Yi Ho , Shou-Kuo Hsu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW100128483A 20110810
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/18 ; H05K1/11
Abstract:
A printed circuit board includes a first to a fifth connector pads, a first to an eighth coupling capacitor pads, a first to a tenth transmission lines, a first via and a second via, a first to a fourth sharing pads, and a voltage converting circuit. The printed circuit board is operable to selectively support different types of connectors.
Public/Granted literature
- US20130039025A1 PRINTED CIRCUIT BOARD Public/Granted day:2013-02-14
Information query
