Invention Grant
US08456858B2 Serial advanced technology attachment dual in-line memory module assembly
失效
串行高级技术附件双列直插式内存模组装配
- Patent Title: Serial advanced technology attachment dual in-line memory module assembly
- Patent Title (中): 串行高级技术附件双列直插式内存模组装配
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Application No.: US13278090Application Date: 2011-10-20
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Publication No.: US08456858B2Publication Date: 2013-06-04
- Inventor: An-Gang Liang , Hung-Yi Wu , Zheng-Heng Sun
- Applicant: An-Gang Liang , Hung-Yi Wu , Zheng-Heng Sun
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110273425 20110915
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/11
Abstract:
A serial advanced technology attachment dual-in-line memory module (SATA DIMM) assembly includes a SATA DIMM module with a circuit board and a cable member. A first edge connector is set on a bottom edge of the circuit board to be connected to a memory slot of a motherboard. A second edge connector is arranged on an end of the circuit board. The cable member includes a cable, a first storage device interface extending from a first end of the cable to be connected to a second storage device interface of the motherboard, and a third edge connector formed on a second end of the cable and soldered to the second edge connector.
Public/Granted literature
- US20130070411A1 SERIAL ADVANCED TECHNOLOGY ATTACHMENT DUAL IN-LINE MEMORY MODULE ASSEMBLY Public/Granted day:2013-03-21
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