Invention Grant
- Patent Title: Stacked memory and devices including the same
- Patent Title (中): 堆叠的内存和设备包括相同
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Application No.: US13007716Application Date: 2011-01-17
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Publication No.: US08456881B2Publication Date: 2013-06-04
- Inventor: Chi Sung Oh
- Applicant: Chi Sung Oh
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2010-0028985 20100331
- Main IPC: G11C5/02
- IPC: G11C5/02
Abstract:
In one embodiment, the stacked memory includes a first group of stacked memory chips, a second group of stacked memory chips, and connection terminals configured to electrically connect a first memory chip among the stacked memory chips in the first group to a second memory chip among the stacked memory chips in the second group.
Public/Granted literature
- US20110242870A1 STACKED MEMORY AND DEVICES INCLUDING THE SAME Public/Granted day:2011-10-06
Information query
