A dynamic random access memory (DRAM) device includes a first and second integrated circuit (IC) die. The first integrated circuit die has test circuitry to generate redundancy information. The second integrated circuit die is coupled to the first integrated circuit die in a packaged configuration including primary storage cells and redundant storage cells. The second integrated circuit die further includes redundancy circuitry responsive to the redundancy information to substitute one or more of the primary storage cells with one or more redundant storage cells.