An optical multi-chip module (MCM) is provided. A printed circuit board (PCB) overlies a package bottom and has die contact regions, each having at least one electrical interface. A first die contact region is formed in a PCB top surface recess, and an optical component die has a bottom surface with an area about matching the PCB top surface recess. The optical component die has an optical port with microlens. An electrical component die has a bottom surface with at least one electrical interface connected to the second die electrical interface, which is connected to the first die electrical interface via a PCB trace. A wire bond is connected between the electrical component die and a package interconnection lead. A cover assembly connector has an optical port with a microlens, configured to communicate with the optical component die optical port, and a fiber port to accept an optical fiber.