Invention Grant
- Patent Title: Architecture, protocols and frame formats for wireless multi-hop relay networks
- Patent Title (中): 无线多跳中继网络的架构,协议和帧格式
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Application No.: US11529982Application Date: 2006-09-29
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Publication No.: US08457674B2Publication Date: 2013-06-04
- Inventor: Sumeet Sandhu , Ozgur Oyman
- Applicant: Sumeet Sandhu , Ozgur Oyman
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Kacvinsky Daisak PLLC
- Main IPC: H04L5/22
- IPC: H04L5/22 ; H04W4/00 ; H04W36/00 ; H04W40/00 ; H04J3/00 ; H04B3/36 ; H04B7/14 ; H04B1/60 ; H04B17/02 ; H04B7/15 ; H04B7/00

Abstract:
Methods, protocols and systems for communicating in a multi-hop wireless mesh network may include explicitly providing information relating to backhaul wireless link qualities in multi-hop wireless mesh network to next generation subscriber stations in a first mode. In a second mode, embodiments are configured to implicitly provide indicia of multi-hop wireless link qualities to legacy subscriber stations by adjusting a transmit power of frames sent to the legacy subscriber stations. Other embodiments and variations are described in the detailed description.
Public/Granted literature
- US20080080436A1 Architecture, protocols and frame formats for wireless multi-hop relay networks Public/Granted day:2008-04-03
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