Invention Grant
- Patent Title: Implantable medical electrical stimulation lead fixation method and apparatus
- Patent Title (中): 植入式医用电刺激铅固定方法及装置
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Application No.: US11380458Application Date: 2006-04-27
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Publication No.: US08457763B2Publication Date: 2013-06-04
- Inventor: Martin T. Gerber , Eric H. Bonde
- Applicant: Martin T. Gerber , Eric H. Bonde
- Applicant Address: US MA Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MA Minneapolis
- Main IPC: A61N1/00
- IPC: A61N1/00

Abstract:
The invention includes an implantable medical electrical lead for electrical stimulation of body tissue that includes at least one modifiable portion that exhibits a first configuration when exposed to a first temperature and a second configuration when exposed to a second temperature, wherein the second configuration of the modifiable portion exhibits a greater resistance to movement of the lead within the body tissue than does the first configuration, and the second temperature is higher than the first temperature; and at least one electrode configured to provide electrical stimulation of body tissue, wherein the lead has a proximal end and a distal end. Systems including leads of the invention and methods of implanting leads of the invention are also included.
Public/Granted literature
- US20070255364A1 IMPLANTABLE MEDICAL ELECTRICAL STIMULATION LEAD FIXATION METHOD AND APPARATUS Public/Granted day:2007-11-01
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