Invention Grant
- Patent Title: Modular manifold system
- Patent Title (中): 模块化歧管系统
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Application No.: US13003974Application Date: 2009-07-13
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Publication No.: US08457773B2Publication Date: 2013-06-04
- Inventor: Dinesh Budapanahalli
- Applicant: Dinesh Budapanahalli
- Applicant Address: CA Bolton, Ontario
- Assignee: Husky Injection Molding Systems Ltd.
- Current Assignee: Husky Injection Molding Systems Ltd.
- Current Assignee Address: CA Bolton, Ontario
- International Application: PCT/US2009/050347 WO 20090713
- International Announcement: WO2010/009023 WO 20100121
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A method of manufacturing a manifold assembly (22) in accordance with specifications required by a mold is provided. The method includes selecting a manifold (22) from a predetermined set of manifolds (22) and sub-manifolds (24) selected from a predetermined set of sub-manifolds (24). Both the manifolds (22) and the sub-manifolds (24) are at least partially manufactured to define first and second portions of the melt channels (28). Injection nozzles (26) are also selected for each sub-manifold (24), defining third portions of the melt channels (28). The manifold (22), the at least one sub-manifold (24) and the injection nozzles (26) are arranged and assembled together so that the first portions, the second portions and the third portions of the melt channels (28) cooperatively define the melt channels (28) operable to direct a melt material to gates located in the mold. The invention further includes a manifold assembly manufactured using the methods described herein.
Public/Granted literature
- US20110123668A1 Modular Manifold System Public/Granted day:2011-05-26
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