Invention Grant
- Patent Title: Substrate processing apparatus, control method of the substrate processing apparatus, manufacturing method of semiconductor device and apparatus state shifting method
- Patent Title (中): 基板处理装置,基板处理装置的控制方法,半导体装置的制造方法以及装置状态移动方法
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Application No.: US12897111Application Date: 2010-10-04
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Publication No.: US08457774B2Publication Date: 2013-06-04
- Inventor: Yukio Ozaki , Satoru Takahata , Ichiro Nunomura
- Applicant: Yukio Ozaki , Satoru Takahata , Ichiro Nunomura
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2009-231320 20091005; JP2010-161560 20100716
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
To perform a maintenance work safely by a maintenance engineer, even if the maintenance work is performed with power of a substrate processing apparatus turned-on. A substrate processing apparatus, comprising: a controller that inhibits a shift from an idling state to a standby state, when a generation of a prescribed event is detected; the controller further comprising: a shift indicating part that controls an apparatus state so as to be shifted from the idling state possible to receive an indication of execution of the recipe, being an apparatus state possible to step into the substrate processing apparatus, to the standby state possible to execute a recipe, being an apparatus state impossible to step into the substrate processing apparatus; and an event detection part that detects a generation of the prescribed event for inhibiting a shift from the idling state to the standby state and notifies the shift indicating part of the prescribed event.
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