Invention Grant
US08457806B2 Managing an infrastructure having a 3D package and cooling resource actuators
有权
管理具有3D封装和冷却资源执行器的基础架构
- Patent Title: Managing an infrastructure having a 3D package and cooling resource actuators
- Patent Title (中): 管理具有3D封装和冷却资源执行器的基础架构
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Application No.: US12790436Application Date: 2010-05-28
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Publication No.: US08457806B2Publication Date: 2013-06-04
- Inventor: Amip J. Shah , Chandrakant Patel , Ratnesh Kumar Sharma
- Applicant: Amip J. Shah , Chandrakant Patel , Ratnesh Kumar Sharma
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G05D23/00
- IPC: G05D23/00 ; H05K7/20

Abstract:
An apparatus for managing an infrastructure having one or more three-dimensional (3D) packages and a plurality of cooling resource actuators, each of the 3D packages including a plurality of heat sources, includes a heat source manager configured to determine heat load profiles of the heat sources. The apparatus also includes a cooling resource manager configured to determine capabilities of the plurality of cooling resource actuators to meet heat load demands of the plurality of heat sources based on the heat load profiles of the plurality of heat sources and an integrated thermal manager configured to match the capabilities of the plurality of cooling resource actuators to the heat load profiles of the plurality of heat sources.
Public/Granted literature
- US20110295443A1 MANAGING AN INFRASTRUCTURE HAVING A 3D PACKAGE AND COOLING RESOURCE ACTUATORS Public/Granted day:2011-12-01
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