Invention Grant
- Patent Title: Pressure sensor assembly
- Patent Title (中): 压力传感器组件
-
Application No.: US13195756Application Date: 2011-08-01
-
Publication No.: US08459125B2Publication Date: 2013-06-11
- Inventor: Richard A. Wade , Ryan Jones , Todd Eckhardt , James A. Machir , Ian Bentley
- Applicant: Richard A. Wade , Ryan Jones , Todd Eckhardt , James A. Machir , Ian Bentley
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Seager Tufte & Wickhem LLC.
- Main IPC: G01L9/00
- IPC: G01L9/00 ; G01L7/00

Abstract:
The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor assembly may include a pressure port connected to a sensor unit, an electrical connector connected to the sensor unit and an outer housing encompassing at least portions of the pressure port, sensor unit and electrical connector. In some instances, the sensor unit may include pressure signal output terminals electrically connected to electrical terminals of the electrical connector.
Public/Granted literature
- US20130031985A1 PRESSURE SENSOR ASSEMBLY Public/Granted day:2013-02-07
Information query