Invention Grant
- Patent Title: Flat heat pipe with vapor channel
- Patent Title (中): 带有蒸汽通道的扁平热管
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Application No.: US12817206Application Date: 2010-06-17
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Publication No.: US08459340B2Publication Date: 2013-06-11
- Inventor: Yue Liu , Sheng-Liang Dai , Jin-Peng Liu , Sheng-Guo Zhou , Sheng-Lin Wu , Yu-Liang Lo
- Applicant: Yue Liu , Sheng-Liang Dai , Jin-Peng Liu , Sheng-Guo Zhou , Sheng-Lin Wu , Yu-Liang Lo
- Applicant Address: CN Kunshan TW New Taipei
- Assignee: Furui Precise Component (Kunshan) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Furui Precise Component (Kunshan) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Kunshan TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010300330 20100115
- Main IPC: F28D15/00
- IPC: F28D15/00 ; H05K7/20

Abstract:
An exemplary flat heat pipe with an evaporator section and a condenser section includes a hollow casing, and a first wick structure and a second wick structure in the casing. The second structure contacts an inner surface of the casing at the evaporator section. The first structure at the evaporator section includes a first contact portion contacting an inner surface of the second structure, and a first isolated portion from the inner surface of the second structure. The first isolated portion and the inner surface of the second structure define a first channel therebetween. The first structure at the condenser section includes a second contact portion contacting the inner surface of the casing, and a second isolated portion from the inner surface of the casing. The second isolated portion and the inner surface of the casing define therebetween a second channel communicating with the first channel.
Public/Granted literature
- US20110174465A1 FLAT HEAT PIPE WITH VAPOR CHANNEL Public/Granted day:2011-07-21
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