Invention Grant
- Patent Title: Suture packaging and methods related thereto
- Patent Title (中): 缝合包装及其相关方法
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Application No.: US12677505Application Date: 2008-09-10
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Publication No.: US08459446B2Publication Date: 2013-06-11
- Inventor: Martin J. Kozlowski
- Applicant: Martin J. Kozlowski
- Applicant Address: US NJ Somerville
- Assignee: Ethicon, Inc.
- Current Assignee: Ethicon, Inc.
- Current Assignee Address: US NJ Somerville
- Agent Jon A. Chiodo
- International Application: PCT/US2008/075849 WO 20080910
- International Announcement: WO2009/036060 WO 20090319
- Main IPC: A61B17/06
- IPC: A61B17/06

Abstract:
Suture packaging and methods of use related thereto, wherein sutures are stored in suture packaging (100) having a panel (102) with apertures (104), needle parks (106, 500) removably or fixedly and selectively inserted into the apertures, and wrapping pegs (108, 400) removably or fixedly and selectively inserted into the apertures. The suture package can further comprise a tab (716) and a tab slot (718) for closing the package.
Public/Granted literature
- US20110056859A1 SUTURE PACKAGING AND METHODS RELATED THERETO Public/Granted day:2011-03-10
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