Invention Grant
US08459779B2 Heater chips with silicon die bonded on silicon substrate, including offset wire bonding
失效
加热芯片与硅芯片贴合在硅基板上，包括偏移引线键合
- Patent Title: Heater chips with silicon die bonded on silicon substrate, including offset wire bonding
- Patent Title (中): 加热芯片与硅芯片贴合在硅基板上，包括偏移引线键合
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Application No.: US13237015Application Date: 2011-09-20
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Publication No.: US08459779B2Publication Date: 2013-06-11
- Inventor: Burton Joyner, II , Carl Sullivan , Frank Anderson , Timothy Strunk
- Applicant: Burton Joyner, II , Carl Sullivan , Frank Anderson , Timothy Strunk
- Applicant Address: US KY Lexington
- Assignee: Lexmark International, Inc.
- Current Assignee: Lexmark International, Inc.
- Current Assignee Address: US KY Lexington
- Agency: Amster, Rothstein & Ebenstein LLP
- Main IPC: B41J2/05
- IPC: B41J2/05
Abstract:
A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die. A wire bond connects to the front of the substrate, but is offset from die.
Public/Granted literature
- US20120133710A1 Heater Chips with Silicon Die Bonded on Silicon Substrate, Including Offset Wire Bonding Public/Granted day:2012-05-31
Information query
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