An electronic device is provided. The electronic device includes a substrate, a plurality of electrodes, a soldering material and a plurality of pins. The electrodes are formed in the substrate. The soldering material is disposed on the electrodes. The pins contact the soldering material and electrically connect to the electrodes, wherein at least one of the pins includes a post and a base. The post has a fixing end. The base is disposed on the fixing end of the post, wherein a plurality of openings are formed on the base, passing through the base along an axis, and the axis is parallel to the post.