Invention Grant
US08460057B2 Computer-implemented process control in chemical mechanical polishing
有权
化学机械抛光中计算机实现的过程控制
- Patent Title: Computer-implemented process control in chemical mechanical polishing
- Patent Title (中): 化学机械抛光中计算机实现的过程控制
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Application No.: US13089189Application Date: 2011-04-18
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Publication No.: US08460057B2Publication Date: 2013-06-11
- Inventor: Boguslaw A. Swedek , Bret W. Adams , Sanjay Rajaram , David A. Chan , Manoocher Birang
- Applicant: Boguslaw A. Swedek , Bret W. Adams , Sanjay Rajaram , David A. Chan , Manoocher Birang
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B49/00
- IPC: B24B49/00 ; B24B51/00
Abstract:
A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.
Public/Granted literature
- US20110195528A1 POLISHING SYSTEM WITH IN-LINE AND IN-SITU METROLOGY Public/Granted day:2011-08-11
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