Invention Grant
- Patent Title: Injection molding method
- Patent Title (中): 注塑法
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Application No.: US13077916Application Date: 2011-03-31
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Publication No.: US08460594B2Publication Date: 2013-06-11
- Inventor: Chia-Ling Hsu
- Applicant: Chia-Ling Hsu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW100102583A 20110125
- Main IPC: B29C33/56
- IPC: B29C33/56 ; B29C45/83
Abstract:
An injection molding method includes: providing a mold core which defines a mold cavity, depositing a lubrication layer on an inner surface of the mold cavity, injecting plastic material into the mold cavity, and molding the plastic material into the plastic element.
Public/Granted literature
- US20120187601A1 INJECTION MOLDING METHOD Public/Granted day:2012-07-26
Information query
