Invention Grant
- Patent Title: High-throughput CVD system
- Patent Title (中): 高通量CVD系统
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Application No.: US12559961Application Date: 2009-09-15
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Publication No.: US08460752B2Publication Date: 2013-06-11
- Inventor: Leonard Rosenbaum , Karlheinz Strobl , Paul J. Decker
- Applicant: Leonard Rosenbaum , Karlheinz Strobl , Paul J. Decker
- Applicant Address: US NY Ronkonkoma
- Assignee: CVD Equipment Corporation
- Current Assignee: CVD Equipment Corporation
- Current Assignee Address: US NY Ronkonkoma
- Agency: Hoffmann & Baron, LLP
- Main IPC: C23C16/00
- IPC: C23C16/00

Abstract:
The use of deposition modules groups for each CVD deposition position including at least two deposition modules, together with a Motion Control System that controls and confines the motion of said deposition modules, enables a quick deposition module exchange at the deposition locations of On-Line or Off-Line CVD coating system. This results in a high volume large area CVD coating system that can increase the commercial viability of a given CVD system design through production throughput increases, production cost reductions, overall higher process flexibility and/or improved film quality.
Public/Granted literature
- US20100068384A1 High-Throughput CVD System Public/Granted day:2010-03-18
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