Invention Grant
- Patent Title: Self-aligned wafer bonding
- Patent Title (中): 自对准晶片接合
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Application No.: US12500892Application Date: 2009-07-10
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Publication No.: US08460794B2Publication Date: 2013-06-11
- Inventor: Jun Zheng , Dadi Setiadi
- Applicant: Jun Zheng , Dadi Setiadi
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Agency: Mueting Raasch & Gebhardt PA
- Main IPC: B32B9/00
- IPC: B32B9/00 ; B32B33/00
Abstract:
A wafer article includes a substrate, two or more hydrophilic areas disposed on the substrate, hydrophobic areas surrounding the hydrophilic areas, and a eutectic bonding material disposed on the substrate. A wafer apparatus including two wafers having complimentary hydrophilic regions and eutectic bonding material is disclosed and a method of forming a bonded wafer articles is disclosed.
Public/Granted literature
- US20110008632A1 SELF-ALIGNED WAFER BONDING Public/Granted day:2011-01-13
Information query
