Invention Grant
- Patent Title: Fast thermal annealing of GaN LEDs
- Patent Title (中): GaN LED快速热退火
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Application No.: US13199276Application Date: 2011-08-24
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Publication No.: US08460959B2Publication Date: 2013-06-11
- Inventor: Yun Wang , Andrew M. Hawryluk
- Applicant: Yun Wang , Andrew M. Hawryluk
- Applicant Address: US CA San Jose
- Assignee: Ultratech, Inc.
- Current Assignee: Ultratech, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Opticus IP Law PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
Methods of performing fast thermal annealing in forming GaN light-emitting diodes (LEDs) are disclosed, as are GaN LEDs formed using fast thermal annealing having a time duration of 10 seconds or faster. An exemplary method includes forming a GaN multilayer structure having a n-GaN layer and a p-GaN layer that sandwich an active layer. The method includes performing fast thermal annealing of the p-GaN layer using either a laser or a flash lamp. The method further includes forming a transparent conducting layer atop the GaN multilayer structure, and adding a p-contact to the transparent conducting layer and a n-contact to the n-GaN layer. The resultant GaN LEDs have enhanced output power, lower turn-on voltage and reduced series resistance.
Public/Granted literature
- US20110309374A1 Fast thermal annealing of GaN LEDs Public/Granted day:2011-12-22
Information query
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