Invention Grant
- Patent Title: Bipolar semiconductor device and manufacturing method thereof
- Patent Title (中): 双极半导体器件及其制造方法
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Application No.: US11919350Application Date: 2006-06-09
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Publication No.: US08460994B2Publication Date: 2013-06-11
- Inventor: Ken-ichi Nonaka
- Applicant: Ken-ichi Nonaka
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPP2005-172620 20050613
- International Application: PCT/JP2006/312077 WO 20060609
- International Announcement: WO2006/135031 WO 20061221
- Main IPC: H01L21/331
- IPC: H01L21/331

Abstract:
A semiconductor crystal includes a recombination-inhibiting semiconductor layer (17) of a second conductive type that is disposed in the vicinity of the surface between a base contact region (16) and emitter regions (14) and that separates the semiconductor surface having a large number of surface states from the portion that primarily conducts the positive hole electric current and the electron current. Recombination is inhibited, and the current amplification factor is thereby improved and the ON voltage reduced.
Public/Granted literature
- US20100001290A1 BIPOLAR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-01-07
Information query
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