Invention Grant
US08461045B2 Bond pad connection to redistribution lines having tapered profiles
有权
焊盘连接到具有锥形轮廓的再分配线
- Patent Title: Bond pad connection to redistribution lines having tapered profiles
- Patent Title (中): 焊盘连接到具有锥形轮廓的再分配线
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Application No.: US13050424Application Date: 2011-03-17
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Publication No.: US08461045B2Publication Date: 2013-06-11
- Inventor: Kuo-Ching Hsu , Chen-Shien Chen , Hon-Lin Huang
- Applicant: Kuo-Ching Hsu , Chen-Shien Chen , Hon-Lin Huang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L29/41 ; H01L21/768
Abstract:
An integrated circuit structure includes a semiconductor substrate having a front side and a backside. A through-silicon via (TSV) penetrates the semiconductor substrate, wherein the TSV has a back end extending to the backside of the semiconductor substrate. A redistribution line (RDL) is formed over the backside of the semiconductor substrate and connected to the back end of the TSV. A passivation layer is over the RDL with an opening formed in the passivation layer, wherein a portion of a top surface of the RDL and a sidewall of the RDL are exposed through the opening. A metal finish is formed in the opening and contacting the portion of the top surface and the sidewall of the RDL.
Public/Granted literature
- US20110165776A1 Bond Pad Connection to Redistribution Lines Having Tapered Profiles Public/Granted day:2011-07-07
Information query
IPC分类:
