Invention Grant
- Patent Title: Card structure, socket structure, and assembly structure thereof
- Patent Title (中): 卡结构,插座结构及其组装结构
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Application No.: US13707459Application Date: 2012-12-06
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Publication No.: US08461458B2Publication Date: 2013-06-11
- Inventor: Chih-Yuan Liu , Chien-Hong Lin , Yuan-Heng Sun
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Priority: TW98136426A 20091028
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00

Abstract:
A card structure includes a first substrate, a second substrate, and a connector. The first substrate includes a base surface, wherein at least one electronic part region and a terminal region are disposed on the base surface. The second substrate is disposed on the base surface and is coupled to the terminal region of the first substrate. The connector is disposed on the base surface to juxtapose the second substrate. The connector includes a connecting surface, a contact unit, and a plurality of contact regions disposed on the connecting surface and coupled to the contact unit and the terminal region, such that the plurality of contact regions are coupled to the second substrate via the terminal region of the first substrate.
Public/Granted literature
- US20130095674A1 CARD STRUCTURE, SOCKET STRUCTURE, AND ASSEMBLY STRUCTURE THEREOF Public/Granted day:2013-04-18
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