The present invention places an electronic controller and/or a triac in a frame, a cover, a chase, or a mounting member of a heated glass panel assembly, where the panel has a conductive coating dispose on it. By placing the controller in the panel frame, the cover, the chase, or the mounting member, field wiring of the panel assembly is greatly reduced, wire lengths are standardized, production glazing, wiring, and pre-testing are facilitated, and installation time and complexity are minimized. By placing the triac in thermal contact with the panel frame, the cover, the chase, or the mounting member, the heat from the triac may be used to complement the heat supplied by the assembly.