Invention Grant
- Patent Title: Semiconductor device and a method of fabricating a semiconductor device
- Patent Title (中): 半导体器件和半导体器件的制造方法
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Application No.: US13104368Application Date: 2011-05-10
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Publication No.: US08461569B2Publication Date: 2013-06-11
- Inventor: Joanna Krystyna Skiba-Szymanska , Andrew James Shields
- Applicant: Joanna Krystyna Skiba-Szymanska , Andrew James Shields
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: GB1007802.0 20100510
- Main IPC: H01L29/06
- IPC: H01L29/06

Abstract:
A semiconductor device includes a quantum dot and a plurality of layers, wherein said plurality of layers includes: a first layer; a stressor layer; and a patterned layer wherein said stressor layer overlies said first layer and said patterned layer overlies said stressor layer; wherein said stressor layer has a substantially different lattice constant to said first layer and said patterned layer and has a pit provided in said layer; said quantum dot lying above said patterned layer aligned with said pit.
Public/Granted literature
- US20110272671A1 SEMICONDUCTOR DEVICE AND A METHOD OF FABRICATING A SEMICONDUCTOR DEVICE Public/Granted day:2011-11-10
Information query
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