Invention Grant
- Patent Title: Light emitting diode package
- Patent Title (中): 发光二极管封装
-
Application No.: US12980272Application Date: 2010-12-28
-
Publication No.: US08461607B2Publication Date: 2013-06-11
- Inventor: Jian-Shihn Tsang
- Applicant: Jian-Shihn Tsang
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99136269A 20101025
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
An exemplary light emitting package includes a base, an LED chip mounted on the base, an encapsulant layer encapsulating the LED chip and a phosphor layer located above and separated from the LED chip. The phosphor layer includes a phosphor scattered portion and a clear portion without phosphor therein. An area of the phosphor scattered portion is smaller than the light emitting area of the encapsulant layer from which light emitted upwardly from the LED chip leaves the encapsulant layer.
Public/Granted literature
- US20120098000A1 LIGHT EMITTING DIODE PACKAGE Public/Granted day:2012-04-26
Information query
IPC分类: