Invention Grant
- Patent Title: Light emitting device package
- Patent Title (中): 发光装置封装
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Application No.: US13110962Application Date: 2011-05-19
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Publication No.: US08461609B2Publication Date: 2013-06-11
- Inventor: Nam Seok Oh
- Applicant: Nam Seok Oh
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2010-0049065 20100526
- Main IPC: H01L33/00
- IPC: H01L33/00 ; F21V9/00
Abstract:
A light emitting device package is provided. The light emitting device package may include a housing including a cavity, a light emitting device disposed within the cavity, a filler filled in the cavity in order to seal the light emitting device, a fluorescent layer disposed on the filler, and an optical filter being disposed within the filler and transmitting light with a particular wavelength.
Public/Granted literature
- US20110291137A1 LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2011-12-01
Information query
IPC分类:
