A light emitting device comprises: a plurality of light emitting diodes and an insulating (low temperature co-fired ceramic) substrate with an array of recesses each for housing a respective one of the light emitting diodes. The substrate incorporates a pattern of electrical conductors that is configured for connecting the light emitting diodes in a selected electrical configuration and to provide at least two electrical connections on the floor of each recess. Light emitting diodes can be electrically connected to the electrical connections by at least one bond wire or by flip chip bonding. Each recess is filled with a transparent material to encapsulate each light emitting diode. The transparent material can incorporate at least one phosphor material such that the device emits light of a selected color and/or color temperature.