Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13202221Application Date: 2011-03-03
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Publication No.: US08461650B2Publication Date: 2013-06-11
- Inventor: Huilong Zhu , Hao Wu , Weiping Xiao
- Applicant: Huilong Zhu , Hao Wu , Weiping Xiao
- Applicant Address: CN Beijing
- Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee: Institute of Microelectronics, Chinese Academy of Sciences
- Current Assignee Address: CN Beijing
- Agency: China Science Law Group
- Priority: CN201010617418 20101231
- International Application: PCT/CN2011/071485 WO 20110303
- International Announcement: WO2012/088795 WO 20120705
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/84 ; H01L21/336

Abstract:
Semiconductor devices and methods for manufacturing the same are disclosed. In one embodiment, the semiconductor device comprises a semiconductor substrate; an insulating layer located on the semiconductor substrate; a semiconductor body located on the insulating layer; a cavity formed in the semiconductor body and into the insulating layer; source/drain regions abutting opposite first side faces of the semiconductor body; gates located on opposite second side faces of the semiconductor body; a channel layer interposed between the respective second side faces and the cavity; and a super-steep-retrograded-well and a halo super-steep-retrograded-well formed in the channel layer. The super-steep-retrograded-well and the halo super-steep-retrograded-well have opposite dopant polarities.
Public/Granted literature
- US20120319190A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-12-20
Information query
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