Invention Grant
- Patent Title: Semiconductor devices including fin shaped semiconductor regions and stress inducing layers
- Patent Title (中): 包括鳍状半导体区域和应力诱导层的半导体器件
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Application No.: US13096324Application Date: 2011-04-28
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Publication No.: US08461653B2Publication Date: 2013-06-11
- Inventor: Chang-woo Oh , Dong-gun Park , Dong-won Kim , Sung-dae Suk
- Applicant: Chang-woo Oh , Dong-gun Park , Dong-won Kim , Sung-dae Suk
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2004-0058785 20040727
- Main IPC: H01L29/41
- IPC: H01L29/41

Abstract:
A semiconductor device may include a substrate, an active semiconductor region of the substrate, and a gate electrode. The active semiconductor region may include a channel region between first and second junction regions. The channel region may include a first semiconductor material, the first and second junction regions may include a second semiconductor material, and the first and second semiconductor materials may be different. The gate electrode may be on the channel region with portions of the first and second junction regions being free of the gate electrode.
Public/Granted literature
- US20110272738A1 Semiconductor Devices Including Fin Shaped Semiconductor Regions and Stress Inducing Layers Public/Granted day:2011-11-10
Information query
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