Invention Grant
- Patent Title: Integrated power converter package with die stacking
- Patent Title (中): 集成功率转换器封装,带芯片堆叠
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Application No.: US12886350Application Date: 2010-09-20
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Publication No.: US08461669B2Publication Date: 2013-06-11
- Inventor: Eric Yang , Jinghai Zhou , Hunt Hang Jiang
- Applicant: Eric Yang , Jinghai Zhou , Hunt Hang Jiang
- Applicant Address: US CA San Jose
- Assignee: Monolithic Power Systems, Inc.
- Current Assignee: Monolithic Power Systems, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Okamoto & Benedicto LLP
- Main IPC: H01L23/52
- IPC: H01L23/52

Abstract:
An integrated circuit for implementing a switch-mode power converter is disclosed. The integrated circuit comprises at least a first semiconductor die having an electrically quiet surface, a second semiconductor die for controlling the operation of said first semiconductor die stacked on said first semiconductor die having said electrically quiet surface and a lead frame structure for supporting said first semiconductor die and electrically coupling said first and second semiconductor dies to external circuitry.
Public/Granted literature
- US20120068320A1 Integrated Power Converter Package With Die Stacking Public/Granted day:2012-03-22
Information query
IPC分类: