Invention Grant
US08461672B2 Reconstituted wafer stack packaging with after-applied pad extensions
有权
重新配置的晶片堆叠封装，并具有后施加的焊盘扩展
- Patent Title: Reconstituted wafer stack packaging with after-applied pad extensions
- Patent Title (中): 重新配置的晶片堆叠封装，并具有后施加的焊盘扩展
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Application No.: US12670952Application Date: 2008-07-25
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Publication No.: US08461672B2Publication Date: 2013-06-11
- Inventor: Belgacem Haba , Giles Humpston , David Ovrutsky , Laura Mirkarimi
- Applicant: Belgacem Haba , Giles Humpston , David Ovrutsky , Laura Mirkarimi
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- International Application: PCT/US2008/009207 WO 20080725
- International Announcement: WO2009/017758 WO 20090205
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (12, 12A) each having a front surface (117), contacts (22) exposed at the front surface, a rear surface (118) and edges (18, 20) extending between the front and rear surfaces. Traces (24) connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face (90) of the microelectronic unit. A plurality of conductors (66) may extend along edges of the microelectronic elements from the traces (24) to the top face (90). The conductors may be conductively connected with unit contacts (76) such that the unit contacts overlie the rear surface (118) of the at least one microelectronic element (12A) adjacent to the top face.
Public/Granted literature
- US20110006432A1 RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS Public/Granted day:2011-01-13
Information query
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