Invention Grant
US08461675B2 Substrate panel with plating bar structured to allow minimum kerf width
有权
具有电镀条的基板，其结构允许最小切口宽度
- Patent Title: Substrate panel with plating bar structured to allow minimum kerf width
- Patent Title (中): 具有电镀条的基板，其结构允许最小切口宽度
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Application No.: US11301715Application Date: 2005-12-13
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Publication No.: US08461675B2Publication Date: 2013-06-11
- Inventor: Hem Takiar , Ken Jian Ming Wang , Chih-Chin Liao , Han-Shiao Chen
- Applicant: Hem Takiar , Ken Jian Ming Wang , Chih-Chin Liao , Han-Shiao Chen
- Applicant Address: US TX Plano
- Assignee: SanDisk Technologies Inc.
- Current Assignee: SanDisk Technologies Inc.
- Current Assignee Address: US TX Plano
- Agency: Vierra Magen Marcus LLP
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48
Abstract:
A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.
Public/Granted literature
- US20070132066A1 Substrate having minimum kerf width Public/Granted day:2007-06-14
Information query
IPC分类:
