A packaging structure having an embedded semiconductor element includes: a substrate having opposite first and second surfaces and at least an opening penetrating the first and second surfaces; a first metallic frame disposed around the periphery of the opening on the first surface; a semiconductor chip received in the opening and having an active surface formed with a plurality of electrode pads and an opposite inactive surface; two first dielectric layers formed on the active surface and the inactive surface of the chip, respectively; a first wiring layer formed on the first dielectric layer of the first surface; and a first built-up structure disposed on the first dielectric layer and the first wiring layer. A shape of the opening is precisely controlled through the first metallic frame around the periphery of the predefined opening region, thereby allowing the chip to be precisely embedded in the substrate.