Invention Grant
US08461691B2 Chip-packaging module for a chip and a method for forming a chip-packaging module
有权
用于芯片的芯片封装模块和用于形成芯片封装模块的方法
- Patent Title: Chip-packaging module for a chip and a method for forming a chip-packaging module
- Patent Title (中): 用于芯片的芯片封装模块和用于形成芯片封装模块的方法
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Application No.: US13097127Application Date: 2011-04-29
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Publication No.: US08461691B2Publication Date: 2013-06-11
- Inventor: Thorsten Meyer
- Applicant: Thorsten Meyer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L29/40 ; H01L23/02
Abstract:
A chip-packaging module for a chip is provided, the chip-packaging module including an isolation material configured to cover a chip on at least one side, the isolation material having a first surface proximate to a first side of a chip, and said isolation material having a second surface facing an opposite direction to the first surface; and at least one layer in connection with the chip first side, the at least one layer further configured to extend from the chip first side to the second surface of the isolation material.
Public/Granted literature
- US20120273957A1 CHIP-PACKAGING MODULE FOR A CHIP AND A METHOD FOR FORMING A CHIP-PACKAGING MODULE Public/Granted day:2012-11-01
Information query
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