Invention Grant
- Patent Title: Substrate arrangement
- Patent Title (中): 基板安排
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Application No.: US13061261Application Date: 2008-08-26
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Publication No.: US08461693B2Publication Date: 2013-06-11
- Inventor: Hock Peng Lim , Meng Kiang Lim
- Applicant: Hock Peng Lim , Meng Kiang Lim
- Applicant Address: SG Singapore
- Assignee: Siemens Medical Instruments Pte. Ltd.
- Current Assignee: Siemens Medical Instruments Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- International Application: PCT/SG2008/000314 WO 20080826
- International Announcement: WO2010/024777 WO 20100304
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L29/40
Abstract:
In an embodiment, a substrate arrangement is provided. The substrate arrangement may include a semiconductor substrate including a first contact portion and a second contact portion on a first surface of the semiconductor substrate, wherein the semiconductor substrate is arranged such that the first contact portion and the second contact portion face each other. The substrate arrangement may further include an electrical connector configured to connect the first contact portion and the second contact portion.
Public/Granted literature
- US20110233783A1 SUBSTRATE ARRANGEMENT Public/Granted day:2011-09-29
Information query
IPC分类:
