Invention Grant
US08461694B1 Lead frame ball grid array with traces under die having interlocking features
有权
引线框架球栅阵列，带有模具下的痕迹具有互锁特征
- Patent Title: Lead frame ball grid array with traces under die having interlocking features
- Patent Title (中): 引线框架球栅阵列，带有模具下的痕迹具有互锁特征
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Application No.: US13715771Application Date: 2012-12-14
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Publication No.: US08461694B1Publication Date: 2013-06-11
- Inventor: Saravuth Sirinorakul
- Applicant: UTAC Thai Limited
- Applicant Address: TH Bangna, Bangkok
- Assignee: UTAC Thai Limited
- Current Assignee: UTAC Thai Limited
- Current Assignee Address: TH Bangna, Bangkok
- Agency: Haverstock & Owens, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A package includes a first plated area, a second plated area, a die attached to the first plated area, and a bond coupling the die to the second plated area. The package further includes a molding encapsulating the die, the bond, and the top surfaces of the first and second plated areas, such that the bottom surfaces of the first and second plated areas are exposed exterior to the package. Additional embodiments include a method of making the package.
Information query
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