Invention Grant
US08461699B2 Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device
有权
正型感光性树脂组合物，抗蚀剂图案的制造方法，半导体装置和电子装置
- Patent Title: Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device
- Patent Title (中): 正型感光性树脂组合物，抗蚀剂图案的制造方法，半导体装置和电子装置
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Application No.: US13142057Application Date: 2009-12-16
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Publication No.: US08461699B2Publication Date: 2013-06-11
- Inventor: Hiroshi Matsutani , Takumi Ueno , Alexandre Nicolas , Yukihiko Yamashita , Ken Nanaumi , Akitoshi Tanimoto
- Applicant: Hiroshi Matsutani , Takumi Ueno , Alexandre Nicolas , Yukihiko Yamashita , Ken Nanaumi , Akitoshi Tanimoto
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2008-334127 20081226; JPP2009-110997 20090430; JPP2009-244379 20091023
- International Application: PCT/JP2009/070987 WO 20091216
- International Announcement: WO2010/073948 WO 20100701
- Main IPC: H01L23/29
- IPC: H01L23/29 ; G03C1/00
Abstract:
The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance.
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