Invention Grant
- Patent Title: Wire harness and ECU system
- Patent Title (中): 线束和ECU系统
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Application No.: US12575793Application Date: 2009-10-08
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Publication No.: US08461726B2Publication Date: 2013-06-11
- Inventor: Youichi Maki
- Applicant: Youichi Maki
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-261879 20081008; JP2009-027520 20090209
- Main IPC: H01B7/30
- IPC: H01B7/30

Abstract:
A wire harness is provided to include: one or more electric wires; and an ECU which includes a circuit body electrically connected to one ends of the one or more electric wires and a sealing member that seals the circuit body and the one ends of the one or more electric wires. The one ends of the one or more electric wire are electrically connected to at least one of a power line pattern, a GND line pattern and a signal line pattern of the circuit body.
Public/Granted literature
- US20100088004A1 WIRE HARNESS AND ECU SYSTEM Public/Granted day:2010-04-08
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