Invention Grant
- Patent Title: Voltage compensated integrated circuits
- Patent Title (中): 电压补偿集成电路
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Application No.: US12030180Application Date: 2008-02-12
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Publication No.: US08461891B1Publication Date: 2013-06-11
- Inventor: Robert Fu , Neal A. Osborn , James B. Burr
- Applicant: Robert Fu , Neal A. Osborn , James B. Burr
- Main IPC: H03K3/356
- IPC: H03K3/356
Abstract:
A method and system of voltage compensated integrated circuits. Operating characteristics of integrated circuitry are enhanced by application of voltage compensation.
Information query
IPC分类:
