Invention Grant
US08461895B2 Per die temperature programming for thermally efficient integrated circuit (IC) operation
有权
用于热效率集成电路（IC）操作的每芯片温度编程
- Patent Title: Per die temperature programming for thermally efficient integrated circuit (IC) operation
- Patent Title (中): 用于热效率集成电路（IC）操作的每芯片温度编程
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Application No.: US13281319Application Date: 2011-10-25
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Publication No.: US08461895B2Publication Date: 2013-06-11
- Inventor: Tawfik Arabi , Ali Muhtaroglu
- Applicant: Tawfik Arabi , Ali Muhtaroglu
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Caven & Aghevli LLC
- Main IPC: G06F1/04
- IPC: G06F1/04 ; H03K3/00
Abstract:
Methods and apparatus to provide per die temperature programming for thermally efficient integrated circuit (IC) operation are described. In some embodiments, the junction temperature of an IC component is determined, e.g., to reduce power consumption and/or improve performance. Other embodiments are also described.
Public/Granted literature
- US20120133578A1 PER DIE TEMPERATURE PROGRAMMING FOR THERMALLY EFFICIENT INTEGRATED CIRCUIT (IC) OPERATION Public/Granted day:2012-05-31
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