Invention Grant
- Patent Title: Array substrate having connection wirings
- Patent Title (中): 具有连接布线的阵列基板
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Application No.: US12646200Application Date: 2009-12-23
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Publication No.: US08462308B2Publication Date: 2013-06-11
- Inventor: Manabu Tanahara
- Applicant: Manabu Tanahara
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-330326 20081225
- Main IPC: G02F1/1333
- IPC: G02F1/1333 ; G02F1/1345

Abstract:
An array substrate comprises on an insulative substrate, a plurality of display areas to be portions of a plurality of display panels, in which, each display area is constituted with a plurality of pixels arranged in a matrix, and the pixels is constituted with pixel electrodes formed at intersection portions of plural scan wirings and plural signal wirings; a common wiring is formed outside each display area, for applying a reference voltage to the pixels; a plurality of external-connection terminals is formed outside each display area, to be connected with a driver circuit that drives; and comprises connection wirings located so as to intersect a cutting line along which the insulative substrate is to be cut, for connecting the external-connection terminals in one of the display panels on the insulative substrate with a common wiring in another one of the display panels adjacent to the external-connection terminals, wherein the connection wirings are formed in a conductive layer superior in corrosion resistance to the most inferior corrosion-resistance conductive layer among conductive layers constituting the array substrate.
Public/Granted literature
- US20100163284A1 ARRAY, SUBSTRATE, AND DISPLAY DEVICE AND ITS MANUFACTURING METHOD Public/Granted day:2010-07-01
Information query
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