A metal shielding can includes a top wall and a surrounding wall. The surrounding wall extends downwardly from a periphery of the top wall, and includes a bottom surface and a groove formed in the bottom surface for receiving a tin solder element. The strength of the tin solder element to bond the metal shielding can to a circuit board can thus be enhanced so that the metal shielding can can be secured firmly on the circuit board. Moreover, the tin solder element can be positioned accurately relative to a solder pad of the circuit board, so that the post-soldering precision is easy to control and there is no solder overflow or adverse effect on an electronic component mounted on the circuit board. Thus, rework yield can be enhanced considerably to reduce manufacturing costs.